®
p “无铅”无卤覆铜基板材料发展趋势
For lead free reflow testing patterns
 S1141KF,S1000,S1170,S1000-2                    无铅工艺评估典型PATTERN
BVH chain
0.25 0.3 0.4 1.0 4.0mm hole and Pad diameter
High copper retained BVH  testing area
For 0.1mm BVH
Testing pattern
2
3
4
5
1
•
•Testing pattern A